1. Advanced Flip Chip Packaging
پدیدآورنده : \ Ho-Ming Tong, Yi-Shao Lai, C.P. Wong Editors
کتابخانه: Library of Foreign Languages and Islamic Sources (Qom)
موضوع : Electronic packaging,نصب تجهیزات الکترونیکی,a02,a02,Flip chip technology.
رده :
E-Book
,
2. Advanced flip chip packaging
پدیدآورنده : Ho-Ming Tong, Yi-Shao Lai, C.P. Wong, editors
کتابخانه: Center and Library of Islamic Studies in European Languages (Qom)
موضوع : Electronic packaging,Flip chip technology
رده :
TK7870
.
15
.
A38
2013
3. Flip chip markets and infrastructure developments
پدیدآورنده : / [authors, E. Jan Vardaman ... [et al.]]
کتابخانه: Central Library and Information Center of the University of Mohaghegh Ardabili (Ardabil)
موضوع : Electronic industries- Technological innovations,Electronic packaging,Flip chip technology
رده :
HD9696
.
A2
,
V37
2001
